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Multiphysics Modeling of MEMS

Thursday, March 7, 2019 at 2:00 PM EST

Microelectromechanical systems (MEMS) are fundamentally driven by multiphysics phenomena, and as such, they require a modeling approach where the relevant physical phenomena are included and coupled. Join Dr. James Ransley from Veryst Engineering for a demonstration of how to use multiphysics modeling for these systems.

In the presentation, he will discuss the tools required to model a wide range of sensors and transducers. Effects covered include electromechanical couplings, thin-film damping, thermoelastic damping, and anchor losses.

A live demo in the COMSOL Multiphysics® software will show how to model a MEMS scanning mirror for a lidar use case. A Q&A session will conclude the webinar.

Visualization of the electric potential and displacement field in a surface micromachined accelerometer.


James Ransley, Senior Engineer, Veryst Engineering

Dr. James Ransley has worked for more than 15 years on a wide range of micromechanical systems, including inkjet printheads and inertial sensors. He has extensive experience developing simulation tools for MEMS devices, having previously worked as a developer and then as a technical product manager for the MEMS Module, an add-on to the COMSOL Multiphysics® software. Following his tenure at COMSOL, Dr. Ransley worked as a simulation lead in Analog Devices’ MEMS group, where he created custom simulation tools to facilitate the development of high-precision inertial sensors. He now applies his extensive experience as a consultant with Veryst, where he assists customers developing sensors and actuators for many different use cases.

Yeswanth Rao, Technical Sales Manager, COMSOL

Yeswanth Rao is a technical sales manager and has been with COMSOL since early 2008. He holds a PhD in biological engineering and a master's degree in electrical engineering. His finite element background is in MEMS, particularly piezoelectric modeling.

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