PICs for Advanced Medical Applications 

Fri, May 18, 2018 2:00 PM BST{LOCAL_TZ}




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Introduction
Photonic Integrated Circuits (PICs) are impacting the biomedical field by providing fast, reliable and cost-effective diagnostic devices. These new tools allow for non-invasive detection by providing exciting and new functionalities, such as compact imaging devices that can be used to obtain chemical and morphological information at the same time. Another interesting application is the development of point-of-care instruments based on PICs that can continuously monitor our health, allowing clinical diagnoses to be carried out at any place and at any time.

In this webinar, the focus will be on the different imaging and spectroscopy techniques that can be used for in-vivo/in-vitro diagnosis, highlighting the capabilities of Europe for the high-volume production of this technology, the main challenges and the most impacting developments in diagnosis based on PICs.


Speakers
  • Ana Gonzalez, Project R&D Manager at EPIC & Dissemination Manager at PIXAPP Pilot Line. 
  • Pieter Wuytens, Photonic Innovation Engineer at University of Ghent
  • Douwe Geuzebroek, VP Marketing and Sales at LioniX International

Who should attend?
Anyone interested in new photonics-based technologies that will be key for the next generation of medical devices. It includes medical doctors, companies making components that want to move forward into the value chain and medical integrators of components that want to provide new functionalities into their products. This webinar is also intended for students, engineers and academics that want to have an overview of the market perspectives and current commercial developments.

The webinar is organized by PIXAPP, the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot Line. A highly-interdisciplinary team of Europe’s leading industrial & research organisations provides users with single-point access to PIC assembly and packaging. PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market. For more information please visit www.pixapp.eu and follow us @eu_PIXAPP or in the LinkedIn group: Photonic integrated circuits: assembly, packaging and test (https://www.linkedin.com/groups/12075991)





 
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