Anti-Whisker Press-Fit Plating Technology for the Automotive Industry

Wednesday, March 21, 2018 at 2:00 p.m. U.S. EDT

Click HERE to find the start time at your location

Join Frank Schabert from TE Connectivity for a Webinar and interactive Q&A on LITESURF plating for a new class of headers and connectors in advanced automotive electronics manufacturing. This 60-minute Webinar discusses the engineering of a Bismuth-based coating for press-fit connectors and pins that drastically reduces whisker risk while still using safe, sustainable materials. Learn how global manufacturers are deploying this technology for impressive quality and reliability gains within denser, more capable ECUs.


                                   

Speaker: 



Frank Schabert, Senior Manager R&D / Product Development Engineering, TE Connectivity

Frank Schabert is leading the Global Header Focus Team for TE Connectivity Automotive. This includes technology development for the header product segment, as well as project lead with responsibility for whisker mitigating strategies. Graduated in physics in Berlin, Germany, he did his Ph.D. in biophysics and a postdoc in molecular electronics. Frank was Senior Associate with McKinsey & Company before joining TE Connectivity/AMP in 1998, where he had regional and global assignments in quality, manufacturing, and project management.

Moderator: 

Lisa Arrigo, SAE International




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