Modeling Thermal Effects in Processes and Products

Available On Demand until November 2, 2018

If you are interested in modeling the thermal behavior of devices and manufacturing processes, then tune into this webinar with guest speaker Kyle Koppenhoefer of AltaSim Technologies.

Predicting the response to thermal exposure is critical to the successful development of multiple technologies, including in materials processing to produce controlled microstructures, molecular biology to promote cell growth, and thermal management to prolong the operating lifetime of electronic devices.

Accurate prediction of thermal behavior often requires the inclusion of conduction, convection, and radiation and can be further complicated by the inclusion of phase changes. Thus, numerical simulation is often valuable in predicting the effect of exposure to thermal events and can be of significant benefit to product and process design.

In this webinar, AltaSim Technologies will draw on its experience in the computational analysis of a range of thermal-based technologies to demonstrate ways in which thermal behavior can be successfully analyzed and designed using COMSOL Multiphysics®.

You can ask questions at the end of the webinar during the Q&A session.

Water quenching for metal processing.


Kyle Koppenhoefer, AltaSim Technologies

Kyle Koppenhoefer has been one of the principals and leaders at AltaSim Technologies for 15 years. He works with customers to identify how computational analysis can be used to further develop their products and manufacturing processes. Prior to cofounding AltaSim, Kyle worked for the Department of Defense and the Edison Welding Institute. He holds a PhD in civil engineering from the University of Illinois.

Nicolas Huc, COMSOL

Nicolas Huc joined COMSOL France in 2004 and is currently the head of their development team. He is also the manager of the Heat Transfer Module. Nicolas studied engineering at ENSIMAG before receiving his PhD in living system modeling from Joseph Fourier University.


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