Thermal Management Solutions for Embedded Computing Systems

Available On-Demand until August 16, 2018

Embedded computing systems used in many military and industrial applications are trending toward higher heat fluxes and power requirements. As a result, performance is being hindered by thermal limitations. This is intensified by the enclosed nature of server racks and harsh ambient conditions experienced in many of today’s applications. The thermal path typically involves a heat spreader to get heat from the electronics components to the edge of the board, a retainer clamp/lock to mechanically and thermally couple the board to the chassis and heat spreading or dissipation from the outside of the enclosure.

This Webinar will provide insight to enhance each level of the thermal resistance network, primarily by increasing thermal conductivity with passive thermal technologies. This method is highly reliable and easy to retrofit into existing designs. Heat pipes, vapor chambers and enhanced thermal locks will be investigated as well as best practices for designing the ultimate air or liquid cooled heat sink. Viewers will come away with a strong understanding of passive technologies such as heat pipes, vapor chambers and ACT’s new ICE-Lok™ technology. 

For more information on the presented active thermal technologies, please visit


Kim Fikse, Applications Engineer, Advanced Cooling Technologies, Inc. 

Kimberly Fikse is a sales engineer for both the Defense Aerospace and Custom Products Groups.  Ms. Fikse graduated from Penn State University with a BS in Energy Engineering.  After graduation she worked for BMT Syntek Technologies as an engineering consultant for NAVSEA and NRL working on power and energy projects.  After joining ACT, Ms. Fikse has worked with customers to diagnose complex thermal challenges and develop the appropriate thermal management solution.   

Jens Weyant, Manager, Defense/Aerospace Products, Advanced Cooling Technologies, Inc. 

Mr. Jens Weyant is the Manager for ACT’s Defense Aerospace products group.  Mr. Weyant has gained five years of research experience through his studies and time spent at Advanced Cooling Technologies.  During his time at ACT, he has contributed to thermal solutions for radar, power electronics, rotating equipment and other high power electronics; many of which include heat pipe embedded solutions.  He has served as PI on several SBIR programs including a DARPA (Phase I and II) funded program focused on passivation of laser diode micro channel coolers, a DOE (Phase I and II) funded program on passivation coatings for high power RF loads, and an Army (Phase I) funded program to develop a Liquid Cold Spray system.

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  • In house resource(s)
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  • combination
  • Air Cooling with Heat Sinks
  • Heat Pipes
  • Pumped Liquid
  • Pumped Two Phase
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  • Xponential (AUVSI)
  • Embedded Systems
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