Build and Deploy Simulation Apps for Heat Transfer Analysis

Available On Demand until July 20, 2017

Heat transfer, including multiphysics phenomena such as Joule heating and thermal expansion, is fundamental to the design of reliable products and systems. Through modeling and simulation, gain a better understanding of how temperature changes impact the performance of a device or process. With simulation apps based on your models, colleagues and customers can also perform heat transfer analysis through the use of highly specialized user interfaces.

This webinar features a live demo showing how to model a heat transfer problem as well as build and deploy an app in COMSOL Multiphysics® and COMSOL Server™ products, and concludes with a Q&A session.

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The Finned Pipe simulation application provides an easy-to-use interface for pipe design. The app computes the cooling power and pressure drop for the design parameters and operating conditions specified by the user.


Nicolas Huc, Product Manager, Heat Transfer Module, COMSOL

Nicolas Huc earned his engineering diploma at ENSIMAG his PhD from the University Joseph Fourier, both in Grenoble, France. He joined COMSOL in 2004, where he leads the development team in France and is responsible for the development of the heat transfer modeling capabilities in COMSOL Multiphysics.

Lexi Carver, Technical Marketing Engineer, COMSOL

Lexi Carver is a technical marketing engineer at COMSOL, where she specializes in postprocessing and creates presentations, articles, and handbooks on the powerful features of the COMSOL® software. She holds an MS in mechanical engineering from Northeastern University.


Bruce Bennett, Editor, Tech Briefs Media Group

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