Trends in Packaging
Thu, Jun 26, 2014 1:01 PM EDT
The industry is rapidly developing new approaches to advanced packaging, from Cu column flip chip to wafer level packaging and 3D TSV solutions. Is there a method to the madness? Understand the link between packaging, Si and end products and the forces that are driving change.
Presenter: Dr. Raj Pendse, Vice President & Chief Marketing Officer, STATS ChipPAC
Dr. Raj Pendse is Vice President and Chief Marketing Officer at STATS ChipPAC where he is responsible for marketing and business development of the Company’s Advanced Technology products. Raj has been with STATS ChipPAC for over 13 years in various leadership positions in product engineering, technology and marketing. Prior to joining STATS ChipPAC, Raj held various positions in package engineering and R&D at National Semiconductor Corp and Hewlett-Packard Labs. His work has spanned the gamut from packaging of high-end microprocessors, ASIC and graphics products to low-cost packaging solutions for logic and analog devices that find use in mobile phones and consumer products. His most recent focus has been on Flip Chip and 3D Wafer Level Packaging. Raj completed his BS in Materials Science from IIT Bombay with Top in Class honors and his Doctorate in Materials Science from UC Berkeley.