3D Integration and Advanced Packaging Innovation

Thu, Mar 27, 2014 1:02 PM EDT

3D Integration and Advanced Packaging Innovation 

2.5/3D integration and advanced packaging enable better chip performance in a smaller form factor, meeting the needs of smartphones, tablets, and other advanced devices. However, 2.5/3D packaging creates a new set of manufacturing challenges, such as the need to fabricate copper pillars, TSVs, wafer bumping and redistribution layers – which may involve thicker photoresists, spin-on dielectrics and BCB coatings -- and processing may be done on panels instead of round wafers. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Speakers:

Sitaram Arkalgud is Vice President, 3D technology at Invensas Corp., where he leads the company's 3D-IC research and development efforts. Prior to Invensas, he started and led 3D-IC development at SEMATECH, where the focus was on delivering manufacturable process technologies for 3D interconnects. Previously, Sitaram worked in a variety of roles spanning R&D and manufacturing in memory and logic technologies at Infineon/Qimonda and Motorola. He is the author of several publications and holds 14 U.S. patents. Sitaram holds a master’s degree and a Ph.D. in materials engineering from Rensselaer Polytechnic Institute in Troy, N.Y., and a bachelor’s degree in metallurgical engineering from Karnataka Regional Engineering College, Surathkal, India.

Richard Rogoff is Vice President and General Manager of the Lithography Systems Group at Rudolph Technologies. Prior to joining Rudolph he spent 23 years with ASML in various executive, operational and engineering positions. Most recently he served as Vice President of ASML optics business unit. He received a B.S. in Microelectronic Engineering from Rochester Institute of Technology and a M.B.A. from INSEAD Business School.

 

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Which panel lithography application is most important to your organization?:
  • Panel Fan-Out Packaging
  • Glass interposers for 2.5D packaging
  • High Density organic substrates
  • None of the above
When do you think panel-based advanced packaging processes will reach high volume?:
  • 1 year
  • 3 years
  • 5 years
  • Never